Aplikasyon:Aerospace, BMS, Komunikasyon, Computer, Consumer Electronics, Home appliance, LED, Medical Instruments, Motherboard, Smart electronics, Wireless charging
Feature: Fexible PCB, Taas nga Densidad PCB
Mga Materyal sa Insulasyon: Epoxy Resin, Metal Composite Materials, Organic Resin
Materyal: Aluminum Covered Copper Foil Layer, Complex, Fiberglass Epoxy, Fiberglass Epoxy Resin & Polyimide Resin, Paper Phenolic Copper Foil Substrate, Synthetic Fiber
Teknolohiya sa Pagproseso: Paglangan sa Pressure Foil, Electrolytic Foil